我一直很好奇芯片是如何制造的。把芯片放大10万倍，几百亿个比病毒还小的晶体管排列错综复杂，堪比天鼎星科技。常言道：小富难为无米之炊。每一颗芯片的诞生背后都要从厚厚的石英岩开始。·把石英岩放到一个石墨增塌里面，然后打碎研磨加热提纯，最终拉出一个重达200公斤，纯度为99.
参考资料见原文链接＃:~:text=Semiconductor%20industry%20sales%20worldwide%201987%2D2023&text=In%202022%2C%20semiconductor%20sales%20reached%20580.13%20billion%20U.S.%20dollars%20worldwide.见原文链接 Coating Methods | Semiconductor Lithography | Knowledge Base High throughput optical lithography by scanning a massive array of bowtie aperture antennas at near-field | Scientific Reports Endura PVD A review of molecular-beam epitaxy of wide bandgap complex oxide semiconductors | Journal of Materials Research Heraeus Electronics Advanced Packaging2.5 and 3D semiconductor packaging technology insights Challenges and solutions of 28nm poly etching | Semantic ScholarPlasma etch challenges for next-generation semiconductor manufacturing System-in-Package - an overview | ScienceDirect TopicsA diagram of the fabrication process including， RCA cleaningCatalytic mechanism of tribochemical mechanical polishing on C-face of single crystal 6H-SiC substrate | The International Journal of Advanced Manufacturing Technology Based on the type of the semiconductor material being applied in the...
我们已经知道芯片产业链分位设计、制造、封测和下游应用，并将芯片的制造比喻为在指尖大小的区域建造摩天大厦，今天我们具体讲解这一建造过程。芯片制造又分为晶圆生产和晶圆工艺，其中晶圆工艺又被称为前道工艺（相应地封测被称为后道工艺）。
图14:两条路线相辅相成，进行缩放 出处:Mustafa Badaroglu， “Heterogenous integration technologies: roadmap， look ahead， key challenges” VLSI2022， TW2-5。
